ZXMS6004FFQ-7

Document number: DS44697 Rev. 1 - 2

5 of 9

www.diodes.com

April 2022

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ZXMS6004FFQ-7

Electrical Characteristics (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

Static Characteristics

Drain-Source Clamp Voltage

VDS(AZ)

60

65

70

V

ID = 10mA

Off-State Drain Current

IDSS

—

—

500

nA

VDS = 12V, VIN = 0V

—

—

1

µA

VDS = 36V, VIN = 0V

Input Threshold Voltage

VIN(TH)

0.7

1

1.5

V

VDS = VGS, ID = 1mA

Input Current

IIN

—

60

100

μA

VIN = +3V

—

120

200

VIN = +5V

Input Current while Overtemperature Active

—

—

—

220

μA

VIN = +5V

Static Drain-Source On-State Resistance

RDS(ON)

—

400

600

m

Ω

VIN = +3V, ID = 0.5A

—

350

500

VIN = +5V, ID = 0.5A

Continuous Drain Current (Note 5)

ID

0.9

—

—

A

VIN = 3V; TA = +25°C

1.0

—

—

VIN = 5V; TA = +25°C

Continuous Drain Current (Note 6)

1.2

—

—

VIN = 3V; TA = +25°C

1.3

—

—

VIN = 5V; TA = +25°C

Current Limit (Note 8)

ID(LIM)

0.7

1.7

—

A

VIN = +3V

1

2.2

—

VIN = +5V

Dynamic Characteristics

Turn-On Delay Time

tD(ON)

—

5

—

μs

VDD = 12V, ID = 0.5A, VGS = 5V

Rise Time

tR

—

10

—

Turn-Off Delay Time

tD(OFF)

—

45

—

Fall Time

tF

—

15

—

Overtemperature Protection

Thermal Overload Trip Temperature (Note 9)

TJT

+150

+175

—

°C

—

Thermal Hysteresis (Note 9)

fF

—

+10

—

°C

—

Notes:

5. For a device surface mounted on 15mm x 15mm single sided, 1oz weight copper on 1.6mm FR4 board, in still air conditions.

6. For a device surface mounted on 50mm x 50mm single sided, 2oz weight copper on 1.6mm FR4 board, in still air conditions.

7. Thermal resistance from junction and the mounting surfaces of the drain pins.

8.

The drain current is restricted only when the device is in saturation (see graph ‘Typical Output Characteristic’). This allows the device to be used in the

fully on-state without interference from the current limit. The device is fully protected at all drain currents, as the low power dissipation generated outside

saturation makes current limit unnecessary.

9. Overtemperature protection is designed to prevent device from destruction under fau

lt conditions. Fault conditions are considered as “outside” normal

operating range, so this part is not designed to withstand overtemperature for extended periods.