8.3.2 Layout Example

Serial Bus Traces

Pull-Up Resistors

Supply Bypass

Capacitor

Via to Power or Ground Plane

Via to Internal Layer

Supply Voltage

SCL

GND

ALERT

ADD0

V+

SDA

Ground Plane for

Thermal Coupling

to Heat Source

Heat Source

Figure 8-5. Layout Example (SOT563-6 package)

There are special considerations that need to be taken for the TMP112 X2SON package. These considerations

are due to the center pad being electrically connected to either address or alert (depending on the orderables

shown in Address and Alert Variant Device Target Address) and because of the dimensions of the package and

the pads. With the address option, the center pad can be directly connected with a trace on the same layer to

one of the 4 edge pins for setting the device address as shown in Figure 8-6.

TMP112, TMP112D

SBOS473L – MARCH 2009 – REVISED JULY 2024

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