©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

20°

20°

Maximum

component rotation.

Typical

component

center line

Punched Carrier (Paper Tape) Configuration (Ceramic Chips Only):

Table 1: 8 & 12mm Punched Tape

Variable Dimensions - Millimeters (Inches)

Note:

1. A0, B0 and T determined by the maximum dimensions to the ends of the terminals extending from the

body and/or the body dimensions of the component. The clearance between the ends of the terminals or

body of the component to the sides and depth of the cavity (A0, B0 and T) must be within 0.05mm (.002)

minimum and 0.50mm (.020) maximum. The clearance allowed must also prevent rotation of the component

within the cavity of not more than 20 degrees (see sketches A and B).

2. Tape with components shall pass around radius "R" without damage.

3. KEMET nominal thicknesses are: 0402 = 0.6mm and all others 0.95mm minimum.

8mm

and

12mm

1.5

+0.10, -0.0

(.059

+0.004, -0.0)

1.75 ±0.10

(.069 ±0.004)

4.0 ± 0.10

(.157 ± 0.004)

2.0 ± 0.05

(.079 ± 0.002)

0.10

(.004)

Max.

0.75

(.030)

Min.

0.75

(.030)

Min.

25 (.984)

See Note 2

Table 1

Tape

Size

E

R Min.

8mm

1/2

Pitch

2.0 ± 0.10

(.079 ±.004)

See Require-

ments

Section 3.3 (d)

3.5 ± 0.05

(.138 ± .002)

8.0 ± 0.3

(.315 ± 0.012)

See Note 1

Table 1

1.1mm (.043)

Max. for Paper

Base Tape and

1.6mm (.063)

Max. for Non-

Paper Base

Compositions.

See Note 3.

Tape

Size

W

F

T

8mm

4.0 ± 0.10

(0.157 ± .004)

12mm

4.0 ± 0.10

(0.157 ± .004)

12mm

Double

Pitch

8.0 ± 0.10

(0.315 ± .004)

12.0 ± 0.3

(.472 ± .012)

5.5 ± 0.05

(.217 ± .002)

Table 1: 8 & 12mm Punched Tape

Constant Dimensions - Millimeters (Inches)

Sketch B:

Max. Component

Rotation - Front

Cross Sectional View

Sketch C:

Component Rotation - Top View

F

E

W

Center lines

of cavity

10 pitches cumulative

tolerance on tape

±0.2 (±0.008)

Top

Tape

Cover

T

User Direction of Feed

Max. Cavity Size

See Note 1

Table 1

Bottom

Tape

Cover

R

(Min.)

Sketch A:

Bending Radius

See Note 2

Table 1

CERAMIC CHIP CAPACITORS

Packaging Information

96