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DS-AX1509-01 Aug, 2006
www.Orister.com
DIP-8 Dimension
SOP-8 Dimension
Ordering Information
Part Number
Package
Part Number
Package
AX1509S-ADJ
SOP-8
AX1509P-ADJ
DIP-8
AX1509S -3.3
SOP-8
AX1509P -3.3
DIP-8
AX1509S -5.0
SOP-8
AX1509P -5.0
DIP-8
AX1509S -12
SOP-8
AX1509P -12
DIP-8
A
B
87
65
4
3
2
1
H
I
F
G
J
K
M
L
α1
E
D
C
8-Lead DIP-8
Plastic Package
Package Code: P
DIM
Min.
Max.
A
6.29
6.40
B
9.22
9.32
C
-
*1.52
D
-
*1.27
E
-
*0.99
F
3.25
3.35
G
3.17
3.55
H
0.38
0.53
I
2.28
2.79
J
7.49
7.74
K
-
*3.00
L
8.56
8.81
M
0.229
0.381
α1
94
o
97
o
*: Typical, Unit: mm
A
B
F
C
D
E
G
Part A
I
H
J
K
O
M
L
N
Part A
23
4
5
6
7
8
Pin1 Index
DIM
Min.
Max.
A
4.85
5.10
B
3.85
3.95
C
5.80
6.20
D
1.22
1.32
E
0.37
0.47
F
3.74
3.88
G
1.45
1.65
H
4.80
5.10
I
0.05
0.20
J
0.30
0.70
K
0.19
0.25
L
0.37
0.52
M
0.23
0.28
N
0.08
0.13
O
0.00
0.15
*: Typical, Unit: mm
8-Lead SO-8 Plastic
Surface Mounted Package
Package Code: S
Marking:
Note: Green label is used for pb-free packing
Pin Style: 1.Vin 2.Output 3.FB 4.SD
5.Gnd 6.Gnd 7.Gnd 8.Gnd
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
Marking:
Note: Green label is used for pb-free packing
Pin Style: 1.Vin 2.Output 3.FB 4.SD
5.Gnd 6.Gnd 7.Gnd 8.Gnd
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
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