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RF2314
Rev A6 051025
Thermal Pad and Via Design
The PCB land pattern has been designed with a thermal pad that matches the exposed die paddle size on the bottom of
the device.
Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern shown
has been designed to address thermal, power dissipation and electrical requirements of the device as well as accommo-
dating routing strategies.
The via pattern used for the RFMD qualification is based on thru-hole vias between 0.203mm to 0.330mm finished hole
size with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be
increased by a 4:1 ratio to achieve similar results.
Via
0.203 - 0.330 (mm)
Finished Hole
Figure 3. Thermal Pad and Via Design (RFMD qualification)
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