2001 May 14

2

Philips Semiconductors

Product specification

High-speed switching diode array

BAV99S

FEATURES

• Small plastic SMD package

• High switching speed

• Two electrically isolated series configuration arrays

• Low capacitance.

APPLICATIONS

• General purpose switching in e.g. surface mounted

circuits.

• Rail to rail (ESD) protection.

DESCRIPTION

The BAV99S consists of four single die high speed

switching diodes in two electrically isolated series

configurations, encapsulated in the small SMD SC-88

(SOT363) plastic package.

PINNING

PIN

DESCRIPTION

1

anode (a1)

2

cathode (k2)

3

cathode (k3)/anode (a4)

4

anode (a3)

5

cathode (k4)

6

cathode (k1)/anode (a2)

Fig.1

Simplified outline (SC-88; SOT363)

and symbol.

Marking code: K1.

MSA370

12

3

65

4

Top view

65

4

12

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

Note

1. Solder points at pins: 2, 3, 5 and 6.

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

Per diode

repetitive peak reverse voltage

−

85

V

continuous reverse voltage

−

75

V

continuous forward current

−

200

mA

repetitive peak forward current

−

450

mA

non-repetitive peak forward current

surge; see Fig.4

t=1

µs

−

4.5

A

t=1ms

−

1A

t=1s

−

0.5

A

total power dissipation

−

250

mW

storage temperature

−65

+150

°C

junction temperature

−65

+150

°C