9397 750 14881

© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

Product data sheet

Rev. 01 — 11 April 2005

3 of 9

Philips Semiconductors

BAS116H

75 V, low leakage diode in small SOD123F package

6.

Thermal characteristics

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]

Reflow soldering is the only recommended soldering method.

7.

Characteristics

[1]

[2]

Table 6:

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from

junction to ambient

in free air

[1] [2] -

-

330

K/W

thermal resistance from

junction to solder point

-

-

70

K/W

Table 7:

Characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Per diode

forward voltage

[1] -

-

0.90

mV

[1] -

-

1.00

mV

[1] -

-

1.10

mV

[1] -

-

1.25

mV

reverse current

-

0.003 5.0

nA

-

3

80.0

nA

diode capacitance

-

2

-

pF

reverse recovery

time

[2] -

0.8

3.0

µs