- 3 -
© Andigilog, Inc. 2003
www.andigilog.com
70A03202-004
aTS50
25
50
75
100
125
-25
-50 -40
0
1750
100
750
500
V
OUT (mV)
Temperature (ºC)
1500
Temp (ºC) = (V
OUT – 500mV) / 10mV/ºC
25
50
75
100
125
-25
-50 -40
0
1750
100
750
500
V
OUT (mV)
Temperature (ºC)
1500
25
50
75
100
125
-25
-50 -40
0
25
50
75
100
125
-25
-50 -40
0
1750
100
750
500
V
OUT (mV)
Temperature (ºC)
1500
Temp (ºC) = (V
OUT – 500mV) / 10mV/ºC
Figure 1. aTS50 Output Voltage vs. Temperature
Mounting
The aTS50 can be easily mounted by gluing or
cementing it to a surface. In this case, its temperature
will be within about 0.2°C of the temperature of the
surface it is attached to if the ambient air temperature
is almost the same as the surface temperature. If the
air temperature is much higher or lower than the
surface temperature, the actual temperature of the
aTS50 die will be at an intermediate temperature
between the surface temperature and the air
temperature.
To ensure good thermal conductivity, the backside of
the aTS50 die is directly attached to the GND pin. The
lands and traces to the aTS50 will, of course, be part of
the printed circuit board, which is the object whose
temperature is being measured. These printed circuit
board lands and traces will not cause the aTS50’s
temperature to deviate from the desired temperature.
Alternatively, the aTS50 can be mounted inside a
sealed-end metal tube, and can then be dipped into a
bath or screwed into a threaded hole in a tank. As
with any IC, the aTS50 and accompanying wiring and
circuits must be kept insulated and dry to avoid
leakage and corrosion. This is especially true if the
circuit may operate at cold temperatures where
condensation can occur. Printed-circuit coatings and
varnishes such as Humiseal and epoxy paint or dips
can be used to ensure that moisture cannot corrode
the aTS50 or its connections.
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