MPX4101A

Sensors

6

Freescale Semiconductor

INFORMATION FOR USING THE SMALL OUTLINE PACKAGES

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct

footprint, the packages will self align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and

shorting between solder pads.

Figure 5. SOP Footprint (Case 482)

Figure 6. SSOP Footprint (Case 1317)

0.660

16.76

0.060 TYP 8X

1.52

0.100 TYP 8X

2.54

0.100 TYP 8X

2.54

0.300

7.62

inch

mm

SCALE 2:1

0.027 TYP 8X

0.69

0.053 TYP 8X

1.35

inch

mm

0.387

9.83

0.150

3.81

0.050

1.27

TYP