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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MPC8540CVT667JC датащи(PDF) 82 Page - Freescale Semiconductor, Inc |
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MPC8540CVT667JC датащи(HTML) 82 Page - Freescale Semiconductor, Inc |
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82 / 104 page  MPC8540 Integrated Processor Hardware Specifications, Rev. 4 82 Freescale Semiconductor Thermal Figure 45. MPC8540 Thermal Model 16.2.2 Internal Package Conduction Resistance For the packaging technology, shown in Table 59, the intrinsic internal conduction thermal resistance paths are as follows: • The die junction-to-case thermal resistance • The die junction-to-board thermal resistance Figure 46 depicts the primary heat transfer path for a package with an attached heat sink mounted to a printed-circuit board. Die Lid Substrate and solder balls Heat Source Substrate Side View of Model (Not to Scale) Top View of Model (Not to Scale) x y z Conductivity Value Unit Lid (12 × 14 × 1 mm) kx 360 W/(m × K) ky 360 kz 360 Lid Adhesive—Collapsed resistance (10 × 12 × 0.050 mm) kx 1 ky 1 kz 1 Die (10 × 12 × 0.76 mm) Bump/Underfill—Collapsed resistance (10 × 12 × 0.070 mm) kx 0.6 ky 0.6 kz 1.9 Substrate and Solder Balls (29 × 29 × 1.47 mm) kx 10.2 ky 10.2 kz 1.6 Adhesive Bump/underfill |
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