MPC8250VR datasheet(58/60 Pages) FREESCALE

58 / 60 page

MPC8250 Hardware Specifications, Rev. 1

Freescale Semiconductor

Ordering Information

Figure 19 provides an example of the Freescale part numbering nomenclature for the MPC8250. In

addition to the processor frequency, the part numbering scheme also consists of a part modifier that

indicates any enhancement(s) in the part from the original production design. Each part number also

contains a revision code that refers to the die mask revision number and is specified in the part numbering

scheme for identification purposes only. For more information, contact your local Freescale sales office.

Figure 19. Freescale Part Number Key

Document Revision History

Table 23 provides a revision history for this template.

Table 23. Document Revision History

Revision

Date

Substantive Changes

11/2001

Initial version

0.1

2/2002

• Note 2 for Table 4 (changes in italics): “...greater than

or equal to 266 MHz, 200 MHz CPM...”

• Table 18: core and bus frequency values for the following ranges of MODCK_HMODCK:

0011_000 to 0011_100 and 1011_000 to 1011_1000

• Table 19: footnotes added to pins at AE11, AF25, U5, and V4.

0.2

3/2202

• Table 19: modified notes to pins AE11 and AF25.

• Table 19: added note to pins AA1 and AG4 (Therm0 and Therm1).

0.3

3/2002

• Table 19: modified note to pin AF25.

0.4

5/2002

• Table 2: Notes 2 and 3

• Addition of note on page 8:VDDH and VDD tracking

• Table 14: Note 3

• Table 16: Note 1

• Table 18: Note 3

0.5

9/2002

Addition of VR (516 PBGA) package information. Refer to sections 2.2, 4.2, and 5.

0.6

10/2002 Table 21, “VR Pinout”: corrected ball assignment for the following pins—A12–A17, TA, PD5, PC2.

0.7

10/2002 Table 21, “VR Pinout”: Addition of L3 to the Core (VDDx) pin list (page 53)

0.8

11/2002

Table 21, “VR Pinout”: Addition of C18 to the Ground (GND) pin list (page 53)

Product Code

Device Number

Process Technology

Package

Processor Frequency

Die Revision Level

MPC 8250 A C

Temperature Range

ZU XXX

(CPU/CPM/Bus)

(A = 0.25 micron)

(Blank = 0 to 105 °C

C = -40 to 105 °C)

ZU = 480 TBGA

VR = 516 PBGA

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