RF112 datasheet(39/45 Pages) NXP

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3.9.2 Temperature sensor

Temperature information is available in the regulators as a temperature dependent

voltage. Most regulators have the possibility to apply a buffered version of this voltage

onto the analog testbus. The voltage can then be measured with the AUX ADC, which

makes it possible to measure the temperature at different locations on the chip. Output

value can be processed by calibration unit to provide values in Celsius.

This table shows the temperature sensor specification.

Table 12. Temperature sensor specification

Parameter

Conditions

Min

Typ

Max

Unit

Temperature

responsivity

LSB is referred to register content which is a 14-bit averaged ADC value.

At 27 ° C

LSB / ° C

Accuracy at 100 °

1 sigma value

± 6

° C

Output value

LSB is referred to register content which is a 14-bit averaged ADC value.

100°C (658 mV)

1935

LSB

50°C (571 mV)

606

LSB

27°C (531 mV)

-5

LSB

-40°C (414 mV)

-1786

LSB

Relative accuracy

Temperature

change..

±2

° C

4 Package information

4.1 Mechanical dimensions

The target package is a single row 64-pin extended lead QFN with 0.5mm pitch. This

table shows the package specification of the chip.

Table 13. Package specification

Parameter

Conditions

Minimum

Typical

Maximum

Unit

Number of pins

64 + Flag as

ground

Pin pitch

0.5

Thermal resistance Junction to case.

0.9

K/W

Table continues on the next page...

Package information

RF112 Transceiver Data Sheet, Rev. 1 Draft B, 05/2024

NXP Semiconductors

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