GaAs SP4T Switch

DC - 4.0 GHz

MASW4060G

M/A-COM Inc. and its affiliates reserve the right to make changes to the

product(s) or information contained herein without notice. M/A-COM makes

no warranty, representation or guarantee regarding the suitability of its

products for any particular purpose, nor does M/A-COM assume any liability

whatsoever arising out of the use or application of any product(s) or

information.

• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macom.com for additional data sheets and product information.

V3

1

RoHS

Compliant

Features

• Low Insertion Loss, 1.2 dB Typical

• Fast Switching Speed, 4 nS Typical

• Ultra Low DC Power Consumption

• Terminated Option

• RoHS* Compliant

Description

M/A/COM’s MASW4060G is an SPDT absorptive or

reflective GaAs MESFET MMIC. This part combines

small

size,

low

insertion

loss

and

power

consumption with high isolation. Ideal for many

applications and module use. It will function well for

designs below 4.0 GHz.

The MASW4060G is fabricated using a mature 1-

micron gate length GaAs MESFET process.

The

process features full chip passivation for increased

performance and reliability.

Ordering Information

Part Number

Package

MASW4060G

DIE

1

Bond Pad Dimensions

Pad Layout

Parameter

Absolute Maximum

Control Value (A or B)

-8.5 Vdc

Storage Temperature

-65°C to +175°C

Max Operating Temperature

+175°C

Max Input RF Power

+34 dBm

2. Exceeding any one or combination of these limits may cause

permanent damage to this device.

3. M/A-COM does not recommend sustained operation near

these survivability limits.

RF

0.005 x 0.005 (0.125 x 0.125)

RF1, RF2, RF3, RF4

0.004 x 0.004 (0.100 x 0.100)

A1, A2, A3, A4

0.004 x 0.004 (0.100 x 0.100)

B1, B2, B3, B4

0.004 x 0.004 (0.100 x 0.100)

Bond Pad

Dimensions - Inches

(mm)

G1, G2, G3, G4

4

0.008 x 0.004 (0.200 x 0.100)

T1, T2, T3, T4

5

0.006 x 0.005 (0.150 x 0.125)

Die Size - Inches (mm)

0.076 x 0.058 x 0.010 (1.920 x 1.470 x 0.25)

Schematic

4. “G” pads designate internal grounds necessary to maintain

data sheet isolation. These are not DC blocked and would

need to be blocked if positive control voltage is required.

5. “T” pads denote a 50 W termination path connected to each

RFx port. If bonded to ground, it will cause the related port to

be absorbative, or matched, in the isolated condition. As

described in note 3, these pads are also not DC blocked.

1. Die quantity varies.

* Restrictions on Hazardous Substances, European Union

Directive 2002/95/EC.

Absolute Maximum Rating

2,3