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PHT6N03LT датащи(PDF) 2 Page - NXP Semiconductors |
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PHT6N03LT датащи(HTML) 2 Page - NXP Semiconductors |
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2 / 6 page ![]() Philips Semiconductors Product specification TrenchMOS ™ transistor PHT6N03LT Logic level FET ELECTRICAL CHARACTERISTICS T j= 25˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V (BR)DSS Drain-source breakdown V GS = 0 V; ID = 0.25 mA; 30 - - V voltage T j = -55˚C 27 - - V V (BR)GSS Gate-source breakdown I G = 1 mA 10 - - V voltage V GS(TO) Gate threshold voltage V DS = VGS; ID = 1 mA 1 1.5 2 V T j = 150˚C 0.6 - - V T j = -55˚C - - 2.3 V R DS(ON) Drain-source on-state V GS = 5 V; ID = 3.2 A - 24 30 m Ω resistance V GS = 10 V; ID = 3.2 A - 18 28 m Ω V GS = 5 V; ID = 3.2 A; Tj = 150˚C - - 51 m Ω g fs Forward transconductance V DS = 25 V; ID = 5.9 A 8 14 - S I DSS Zero gate voltage drain V DS = 30 V; VGS = 0 V; - 0.05 10 µA current T j = 150˚C - - 500 µA I GSS Gate source leakage current V GS = ±5 V; VDS = 0 V - 0.02 1 µA T j = 150˚C - - 10 µA Q g(tot) Total gate charge I D = 5.9 A; VDD = 24 V; VGS = 5 V - 24 - nC Q gs Gate-source charge - 3 - nC Q gd Gate-drain (Miller) charge - 11 - nC t d on Turn-on delay time V DD = 15 V; ID = 5.9 A; - 30 45 ns t r Turn-on rise time V GS = 5 V; RG = 5 Ω - 80 130 ns t d off Turn-off delay time Resistive load - 95 135 ns t f Turn-off fall time - 40 55 ns L d Internal drain inductance Measured from tab to centre of die - 3.5 - nH L d Internal drain inductance Measured from drain lead to centre of die - 3.5 - nH L s Internal source inductance Measured from source lead to source - 7.5 - nH bond pad C iss Input capacitance V GS = 0 V; VDS = 25 V; f = 1 MHz - 1050 - pF C oss Output capacitance - 270 - pF C rss Feedback capacitance - 140 - pF REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS T j = 25˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT I S Continuous source current - - 5.9 A (body diode) I SM Pulsed source current (body - - 10 A diode) V SD Diode forward voltage I F = 5.9 A; VGS = 0 V - 0.75 1.2 V t rr Reverse recovery time I F = 5.9 A; -dIF/dt = 100 A/µs; - 100 - ns Q rr Reverse recovery charge V GS = -10 V; VR = 25 V - 0.4 - µC January 1998 2 Rev 1.300 |
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