P12/13

Preliminary, November 2008

ML2002 Preliminary

1. To ensure the good flip-chip assembly quality, we suggest flip-chip bonding house add a “CHECK”

pin for each COG module as shown on the section of “Application Example”. Pin “LOAD” and Pin

“CHECK” shall be connected together if the flip-chip assembly is in good condition. The measured

resistance between Pin “LOAD” and Pin “CHECK” shall not more than 5 kohm.

2. The resistance of ITO glass shall between 15 ohm/□ to 25 ohm/□.

Example :

Each Common shall not connect to each other.

Application Note