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The pulse of progress
Quartz Crystal • MTF32 • MMTF32 • SM26F
8.0+0.3/-0.2
10.0±1.0
anti-heating material
PC board
crystal
rubber glue paste
in mm
6.0+0.1/-0.2
7.5±1.0
in mm
6.0+0.1/-0.2
2.1±0.2
1.1±0.2
0.7±0.1
3.4
1.9
3.8
SM26F type A (1000 pcs per reel)
pad layout
in mm
6.0+0.1/-0.2
3.0±0.2
2.0±0.2
0.7±0.1
2.5
1.75
6.0
SM26F type B (1000 pcs per reel)
pad layout
in mm
Dimensions
tuning fork crystal - handling note
for through hole type
1. mounting: • if the crystal is mounted on board directly (orientation: lay down)
or fixed by metal parts, the body of the crystal will be heated up
• recommended mounting:
2. soldering: • pre-heating +130 °C ~ + 150 °C for 1 to 3 mintues
• soldering +230 °C ~ + 250 °C for 5 seconds maximum
3. cleaning:
• ultrasonic cleaning with organic solvents
• ultrasonic frequency should not be equal to the resonance
frequency of the crystal
4. handling:
• handle the crystal carefully, it cannot stand heavy shock
5. testing:
• if you test the whole board automatically do not apply pulse
to the crystal oscillator circuit, especially high pulse level can
break the crystal blank
MMTF32
MTF32
Jauch Quartz GmbH • Telephone: (+49) 77 20 / 9 45-0 • Telefax: (+49) 77 20 / 9 45-100 • Internet: www.jauch.de • e-mail: hcj@jauch.de • 08/2002
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