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PEMZ1 датащи(PDF) 3 Page - NXP Semiconductors |
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PEMZ1 датащи(HTML) 3 Page - NXP Semiconductors |
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3 / 8 page ![]() 2001 Nov 07 3 Philips Semiconductors Product specification NPN/PNP general purpose transistors PEMZ1 THERMAL CHARACTERISTICS Notes 1. Transistor mounted on an FR4 printed-circuit board. 2. The only recommended soldering method is reflow soldering. CHARACTERISTICS Tamb =25 °C; unless otherwise specified. Note 1. Pulse test: tp ≤ 300 µs; δ≤ 0.02. SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-a thermal resistance from junction to ambient notes 1 and 2 416 K/W SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Per transistor; for the PNP transistor with negative polarity ICBO collector-base cut-off current VCB = 30 V; IE =0 −− 100 nA VCB = 30 V; IE = 0; Tj = 150 °C −− 10 µA IEBO emitter-base cut-off current VEB =4V; IC =0 −− 100 nA hFE DC current gain VCE =6V; IC =1mA 120 −− VCEsat collector-emitter saturation voltage IC = 50 mA; IB = 5.0 mA; note 1 −− 200 mV fT transition frequency IC = 2 mA; VCE = 12 V; f = 100 MHz 100 −− MHz Cc collector capacitance IE =ie = 0; VCB = 12 V; f = 1 MHz TR1 (NPN) −− 1.5 pF TR2 (PNP) −− 2.2 pF |
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