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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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TSL25723FN датащи(PDF) 33 Page - OSRAM GmbH |
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TSL25723FN датащи(HTML) 33 Page - OSRAM GmbH |
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33 / 41 page  Page 32 Datasheet, Public Document Feedback [v2-00] 2022-Nov-30 TSL2572 − Soldering Information The FN package has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The components should be limited to a maximum of three passes through this solder reflow profile. Figure 37: Soldier Reflow Profile Figure 38: Solder Reflow Profile Graph Parameter Reference Device Average temperature gradient in preheating 2.5°C/s Soak time tsoak 2 to 3 minutes Time above 217°C (T1)t1 Max 60 s Time above 230°C (T2) t2 Max 50 s Time above Tpeak −10°C (T3)t3 Max 10 s Peak temperature in reflow Tpeak 260°C Temperature gradient in cooling Max −5°C/s Soldering Information t3 t2 t1 tsoak T3 T2 T1 Tpeak Not to scale — for reference only Time (s) |
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