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TSL2521 датащи(PDF) 72 Page - OSRAM GmbH

номер детали TSL2521
подробное описание детали  Highly Sensitive Ambient Light Sensor with Selective Flicker Detection and Fast Sampling for Brightness Control or Auxiliary to Camera
PDF  81 Pages
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производитель  OSRAM [OSRAM GmbH]
домашняя страница  http://www.osram.com
Logo OSRAM - OSRAM GmbH

TSL2521 датащи(HTML) 72 Page - OSRAM GmbH

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Datasheet, Public
Page 71
[v3-00] 2022-Dec-21
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TSL2521 − Soldering & Storage Information
Soldering Information
The module has been tested and has demonstrated an ability
to be reflow soldered to a PCB substrate. The solder reflow
profile describes the expected maximum heat exposure of
components during the solder reflow process of product on a
PCB. Temperature is measured on top of component. The
components should be limited to a maximum of three passes
through this solder reflow profile.
Figure 91:
Solder Reflow Profile
Note(s):
1. Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum.
Profile Feature Preheat/Soak
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Temperature Min (Tsmin)
100°C
150°C
Temperature Max (Tsmax)
150°C
200°C
Time (ts) from (Tsmin to Tsmax)
60-120 seconds
60-120 seconds
Ramp-up rate (TL to TP)
3°C/second max.
3°C/second max.
Liquidous temperature (TL)
Time (tL) maintained above TL
183°C
60-150 seconds
217°C
60-150 seconds
Peak package body temperature (TP)
For users TP must not exceed the
Classification temp of 235°C
For suppliers TP must equal or
exceed the Classification temp
of 235°C
For users TP must not exceed the
Classification temp of 260°C
For suppliers TP must equal or
exceed the Classification temp of
260°C
Time (tP)
(1) within 5°C of the
specified classification temperature
(Tc)
20(1) seconds
30(1) seconds
Ramp-down rate (TP to TL)
6°C/second max.
6°C/second max.
Time 25°C to peak temperature
6 minutes max.
8 minutes max.
Soldering & Storage
Information



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