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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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TCS37715FN датащи(PDF) 42 Page - OSRAM GmbH |
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TCS37715FN датащи(HTML) 42 Page - OSRAM GmbH |
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42 / 49 page  ams Datasheet Page 41 [v1-31] 2018-Apr-04 Document Feedback TCS3771 − Manufacturing Information The FN package has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The components should be limited to a maximum of three passes through this solder reflow profile. Figure 49: TCS3771 Solder Reflow Profile Figure 50: Solder Reflow Profile Graph Note(s): 1. Not to scale - for reference only. Parameter Reference TCS3771 Average temperature gradient in preheating 2.5°C/sec Soak time tsoak 2 to 3 minutes Time above 217°C (T1) t1 Max 60 sec Time above 230°C (T2) t2 Max 50 sec Time above Tpeak - 10°C (T3) t3 Max 10 sec Peak temperature in reflow Tpeak 260° C Temperature gradient in cooling Max -5°C/sec Manufacturing Information |
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