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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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TCS34007FN датащи(PDF) 28 Page - OSRAM GmbH |
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TCS34007FN датащи(HTML) 28 Page - OSRAM GmbH |
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28 / 35 page  Datasheet, Public Page 27 [v2-00] 2023-Feb-09 Document Feedback TCS3400 − Soldering & Storage Information The FN package has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The components should be limited to a maximum of three passes through this solder reflow profile. Figure 38: Solder Reflow Profile Figure 39: Solder Reflow Profile Graph Parameter Reference Device Average temperature gradient in preheating 2.5°C/s Soak time tsoak 2 to 3 minutes Time above 217°C (T1)t1 Max 60 s Time above 230°C (T2)t2 Max 50 s Time above Tpeak - 10°C (T3)t3 Max 10 s Peak temperature in reflow Tpeak 260°C Temperature gradient in cooling Max -5°C/s Soldering & Storage Information Not to Scale Tpeak Time in seconds t2 T2 T3 T1 t3 |
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