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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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TCS3408 датащи(PDF) 47 Page - OSRAM GmbH |
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TCS3408 датащи(HTML) 47 Page - OSRAM GmbH |
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47 / 53 page  Page 46 Datasheet, Public Document Feedback [v2-00] 2023-Feb-01 TCS3408 − Soldering & Storage Information Floor Life The module has been assigned a moisture sensitivity level of MSL 3. As a result, the floor life of devices removed from the moisture barrier bag is 168 hours from the time the bag was opened, provided that the devices are stored under the following conditions: • Floor Life: 168 hours • Ambient Temperature: <30°C • Relative Humidity: <60% If the floor life or the temperature/humidity conditions have been exceeded, the devices must be rebaked prior to solder reflow or dry packing. Rebaking Instructions When the shelf life or floor life limits have been exceeded, rebake at 50°C for 12 hours. |
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