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AS7220 датащи(PDF) 25 Page - OSRAM GmbH |
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AS7220 датащи(HTML) 25 Page - OSRAM GmbH |
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25 / 33 page ![]() Page 24 ams Datasheet Document Feedback [v1-00] 2017-Feb-16 AS7220 − Soldering, Manufacturing Process Considerations & Storage Information Solder Reflow Profile The module has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The components should be limited to a maximum of three passes through this solder reflow profile. Figure 26: Recommended Reflow Soldering Profile Figure 27: Soldering Profile Graph Profile Feature Reference Device Average temperature gradient in preheating 2.5°C/s Soak Time tSOAK 2 to 3 minutes Time above 217°C (T1) t1 Max 60s Time above 230°C (T2) t2 Max 50s Time above Tpeak - 10°C (T3) t3 Max 10s Peak temperature in reflow Tpeak 260°C Temperature gradient in cooling Max - 5°C/s Soldering, Manufacturing Process Considerations & Storage Information |
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