3

10ETF06SPbF QUIET

Bulletin I2204 03/05

www.irf.com

Fig. 1 - Current Rating Characteristics

Fig. 2 - Current Rating Characteristics

Fig. 3 - Forward Power Loss Characteristics

Fig. 4 - Forward Power Loss Characteristics

T

J

Max. Junction Temperature Range

- 40 to 150

°C

T

stg

Max. Storage Temperature Range

- 40 to 150

°C

R

1.5

°C/W

DC operation

to Case

R

40

°C/W

to Ambient (PCB Mount)**

Soldering Temperature

240

°C

wt

Approximate Weight

2 (0.07)

g (oz.)

Case Style

Marking Device

10ETF06S

Thermal-Mechanical Specifications

Parameters

10ETF..

Units

Conditions

For recommended footprint and soldering techniques refer to application note #AN-994

120

125

130

135

140

145

150

02

46

8

10

12

30°

60°

90°

120°

180°

Conduction Angle

Average Forward Current (A)

10ETF..SSeries

R

(DC) = 1.5 °C/ W

thJC

120

125

130

135

140

145

150

0

2

4

6

8

10

12

14

16

DC

30°

60°

90°

120°

180°

Cond uction Period

Average Forward Current (A)

10ETF..SSeries

R

(DC) = 1.5 °C/ W

thJC

0

4

8

12

16

20

0

4

8

12

16

DC

180°

120°

90°

60°

30°

Average Forward Current (A)

RMSLimit

Conduction Period

10ETF..SSeries

T = 150°C

J

0

2

4

6

8

10

12

14

16

02

4

6

8

10

Average Forward Current (A)

RMSLimit

Cond uction Angle

180°

120°

90°

60°

30°

10ETF..SSeries

T = 150°C

J