Description

HSP-1/HSP-3

No

Thickness, inch (mm)

Adhesive One Side

0.003 (0.076)

Thermal Impeadance [°C-in²/W] (1)

Apparent Thermal Conductivity [W/m-K]

1.0

Phase-Change Temperature [°C]

60

Operating Temperature Range [°C]

-55 to 150

Volume Resistivity [ohm-cm]

1012 Ohm

Specific Gravity

NA

Suggested Heatsink Clamping Pressure, psi (MPa)

Tolerances: ±0.010in/0.3mm

All dimensions are in: Inches [milimeters]

(1) This value is provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.

20 to 100 (0.138 to 0.690)

0.03 @20 psi

HSP-1

For use with all single phase Panel mount SSR’s, Control modules and M50 power modules.

HSP-3

For use will all three phase panel mount SSR’s (53TP/53RV).

3.62

[91.9]

1.74

[44.2]

2.25

[57.1]

2.90

[73.7]

1.87

[47.5]

4.09

[103.9]

0.19

[4.83]

HSP-1

HSP-3

1.87

[47.5]

0.19

[4.83]

Features

• Easy-to-use thermal interface Material designed for use with Standard

single-phase and three-phase solid-state relays.

• Excellent alternative to thermal grease.

• Shipped in packs of 25.

THERMAL PADS | HSP SERIES

ACCESSORIES

GENERAL SPECIFICATIONS

MECHANICAL SPECIFICATIONS

GENERAL NOTES

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