NLAST4599

http://onsemi.com

11

PACKAGE DIMENSIONS

TSOP−6

CASE 318G−02

ISSUE S

23

4

5

6

D

1

e

b

E

A1

A

0.05 (0.002)

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH THICKNESS. MINIMUM LEAD

THICKNESS IS THE MINIMUM THICKNESS OF

BASE MATERIAL.

4. DIMENSIONS A AND B DO NOT INCLUDE

MOLD FLASH, PROTRUSIONS, OR GATE

BURRS.

c

L

0.95

0.037

1.9

0.075

0.95

0.037

mm

inches

SCALE 10:1

1.0

0.039

2.4

0.094

0.7

0.028

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

DIM

A

MIN

NOM

MAX

MIN

MILLIMETERS

0.90

1.00

1.10

0.035

INCHES

A1

0.01

0.06

0.10

0.001

b

0.25

0.38

0.50

0.010

c

0.10

0.18

0.26

0.004

D

2.90

3.00

3.10

0.114

E

1.30

1.50

1.70

0.051

e

0.85

0.95

1.05

0.034

L

0.20

0.40

0.60

0.008

0.039

0.043

0.002

0.004

0.014

0.020

0.007

0.010

0.118

0.122

0.059

0.067

0.037

0.041

0.016

0.024

NOM

MAX

2.50

2.75

3.00

0.099

0.108

0.118

−

−

0

°

10

°

0

°

10

°

q

q