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ACT86600 датащи(PDF) 54 Page - Qorvo, Inc

номер детали ACT86600
подробное описание детали  Hybrid PMIC for Enterprise Storage and Computing
PDF  56 Pages
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производитель  QORVO [Qorvo, Inc]
домашняя страница  https://www.qorvo.com/
Logo QORVO - Qorvo, Inc

ACT86600 датащи(HTML) 54 Page - Qorvo, Inc

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ACT86600
Hybrid PMIC for Enterprise
Storage and Computing
Data Sheet Rev. B, February 2, 2023
Subject to change without notice
54 of 56
www.qorvo.com
®
excessive EMI on the feedback paths and voltage
gradients in the ground plane, both of which can result
in instability or regulation errors. Follow these layout
guidelines when designing the ACT86600 PCB. Refer
to the Qorvo ACT86600 Evaluation Kit for a layout
example.
1.
Place the AVIN input capacitors as close as
possible to the IC. Connect the capacitors
directly to the AVIN input pin and PGND power
ground pin. Do not use vias to route power
between the input capacitors and the IC.
2.
Minimize the switch node trace length between
SW7 and the inductor. Avoid routing sensitive
analog signals near these high frequency, high
dV/dt traces.
3.
The input capacitor and output capacitor
grounds should be connected as close together
as possible, with short, direct, and wide traces.
4.
Connect the PGND ground pin and the AGND
ground pin directly to the exposed pad under
the IC. The AGND ground plane should be
routed separately from the other ground planes
and only connect to the main ground plane
under the IC at the AGND pin.
5.
Connect a 10µF capacitor directly to the VCC5
pin and AGND as close to the IC as possible to
minimize noise on VCC5 because it provides
power to sensitive analog internal circuitry.
Then route the VCC5 net directly to the output
capacitor. Do not connect VCC5 to the output
power plane at the inductor.
6.
Connect the exposed pad directly the top layer
ground plane. Connect the top layer ground
plane to both internal ground planes and the
PCB backside ground plane with thermal vias.
Provide ground plane routing on multiple layers
that allows the IC’s heat to flow into the PCB
and then spread radially from the IC. Avoid
cutting the ground planes and adding vias that
restrict the radial flow of heat of operating
conditions.



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