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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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BAS40 датащи(PDF) 12 Page - NXP Semiconductors |
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BAS40 датащи(HTML) 12 Page - NXP Semiconductors |
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12 / 21 page  BAS40_1PSXXSB4X_SER_7 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 07 — 12 May 2006 12 of 21 Philips Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes 10. Soldering Dimensions in mm Fig 15. Reflow soldering footprint SOD323 (SC-76) Dimensions in mm Fig 16. Wave soldering footprint SOD323 (SC-76) Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 17. Reflow soldering footprint SOD523 (SC-79) msa433 1.65 0.50 (2 ×) 2.10 1.60 2.80 0.60 3.05 0.50 0.95 solder lands solder resist occupied area solder paste MSA415 1.40 4.40 5.00 1.20 2.75 solder lands solder resist occupied area preferred transport direction during soldering MGS343 solder lands solder resist occupied area solder paste 1.80 1.90 0.30 0.40 0.50 1.20 0.60 2.15 |
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