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MXT641T датащи(PDF) 13 Page - ATMEL Corporation |
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MXT641T датащи(HTML) 13 Page - ATMEL Corporation |
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13 / 74 page ![]() 13 mXT641T 1.0 [Datasheet] 9917JX–AT42–02/15 Schematic 3.1 Schematic Notes CAUTION: The device may be permanently damaged if any XVDD pin is shorted to ground or high current is drawn from it. 3.1.1 Decoupling capacitors: 1. Decoupling capacitors must be X7R or X5R and placed <5 mm away from the pins for which they act as bypass capacitors. 2. The schematics show the minimum capacitors required. If the ball configuration means that sharing a bypass capacitor is not possible, then the number of capacitors should be increased. 3. If the device is placed on the system board, the minimum number of capacitors required is as shown in the schematic on page 12. Note that this requires that the voltage regulator supplies for AVDD/VDD and VDDIO are clean and noise free. It also assumes that the track length between the capacitors and on-board power supplies is < 50 mm. 4. If an active tail design is used, the voltage regulators are likely to be some distance from the device and it may be necessary to implement additional decoupling. In this case, a parallel combination of capacitors is recommended to give high and low frequency filtering, as shown in Figure 3-1. Figure 3-1. Additional Recommended Decoupling Capacitors 3.1.2 VDDCORE VDDCore is internally generated from the Vdd 3.3 V power supply. To guarantee stability of the internal voltage regulator, a minimum value of 1 µF must be used for decoupling on VDDCORE. 3.1.3 RESET Line The RESET line is shown on the schematics with a 10 nF capacitor (Creset) to ground. This capacitor is optional but may help if ESD issues are encountered. GND GND 22 nF 2.2 µF AVDD VDD VDDIO 2.2 µF 22 nF 22 nF 1 µF 22 nF NOTE: Recommended additional decoupling capacitors are shown in blue 22 nF 2.2 µF GND GND GND GND |
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