MAX38913, MAX38914

4µVRMS Ultra-Low-Noise 1A LDO with Two-

Level Output Voltage Selection

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Analog Devices | 2

Application Diagram

IN

IN

C1

10µF

GND

EN2

EN1

RSEL2

RSEL1

R1

80.6k

R2

OPEN

C2

47nF

OUT

OUT

OUTS

BYP

C3

10µF

OUTPUT VOLTAGE

3.3V OR 1.8V

UPTO 1A

INPUT VOLTAGE

3.6V TO 5.5V

[EN2:EN1] MODE SELECT

00: OFF

01: MODE1

11: MODE2

10: PASS-THROUGH

Absolute Maximum Ratings

IN, OUT, OUTS to GND ....................................... -0.3V to +6V

BYP to GND.......................................................... -0.3V to +2V

EN1, EN2, POK, PORB to GND ........................... -0.3V to +6V

RSEL1, RSEL2 to GND ..............................-0.3V to VIN + 0.3V

Output Short-Circuit Duration.................................. Continuous

Continuous Power Dissipation (TA = +70°C).............................

WLP (derate 13.73mW/°C above +70°C) ................... 1096mW

TDFN (derate 24.4mW/

C above +70C)................ 1951.2mW

Operating Junction Temperature Range ........ -40°C to +125°C

Maximum Junction Temperature ...................................+150°C

Storage Temperature Range.......................... -65°C to +150°C

Lead Temperature (soldering, 10 seconds) ..................+300°C

Soldering Temperature (reflow).....................................+260°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or

any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Information

WLP

Package Code

N121E1+1

Outline Number

21-100500

Land Pattern Number

Refer to Application Note 1891

Thermal Resistance, Four-Layer Board:

Junction to Ambient (θJA)

72.82°C/W

Junction to Case (θJC)

N/A

TDFN

Package Code

T1433+2C

Outline Number

21-0137

Land Pattern Number

90-0063

Thermal Resistance, Single Layer Board:

Junction to Ambient (θJA)

54°C/W

Junction to Case (θJC)

8°C/W

Thermal Resistance, Four Layer Board:

Junction to Ambient (θJA)

41°C/W

Junction to Case (θJC)

8°C/W