Bus Powered USB2.0 Flash Media Controller

Datasheet

Revision 1.3 (06-13-06)

Page 20

SMSC USB2224

DATASHEET

Chapter 8

Package Outline

Figure 8.1 - 128 Pin TQFP Package

Table 8.1 - 128 Pin TQFP Package Parameters

MIN

NOMINAL

MAX

REMARKS

A

~

~

1.20

Overall Package Height

A1

0.05

~

0.15

Standoff

A2

0.95

~

1.05

Body Thickness

D

15.80

~

16.20

X Span

D1

13.80

~

14.20

X body Size

E

15.80

~

16.20

Y Span

E1

13.80

~

14.20

Y body Size

H

0.09

~

0.20

Lead Frame Thickness

L

0.45

0.60

0.75

Lead Foot Length

L1

~

1.00

~

Lead Length

e

0.40 Basic

Lead Pitch

θ

0

o

~

7

o

Lead Foot Angle

W

0.13

0.18

0.23

Lead Width

R1

0.08

~

~

Lead Shoulder Radius

R2

0.08

~

0.20

Lead Foot Radius

ccc

~

~

0.08

Coplanarity

Notes:

1)

Controlling Unit: millimeter.

2)

Tolerance on the true position of the leads is ± 0.035 mm maximum.

3)

Package body dimensions D1 and E1 do not include the mold protrusion.

Maximum mold protrusion is 0.25 mm.

4)

Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.

5)

Details of pin 1 identifier are optional but must be located within the zone indicated.