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LTE42012R датащи(PDF) 4 Page - NXP Semiconductors |
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LTE42012R датащи(HTML) 4 Page - NXP Semiconductors |
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4 / 12 page ![]() 1997 Feb 21 4 Philips Semiconductors Product specification NPN microwave power transistor LTE42012R THERMAL CHARACTERISTICS Note 1. See “ Mounting recommendations in the General part of handbook SC19a”. CHARACTERISTICS Tmb =25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MAX. UNIT Rth j-mb thermal resistance from junction to mounting-base Tj =75 °C 10 K/W Rth mb-h thermal resistance from mounting-base to heatsink Tj =75 °C; note 1 0.7 K/W SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT ICBO collector cut-off current VCB = 20 V; IE =0 −− 200 µA IEBO emitter cut-off current VEB = 1.5 V; IC =0 −− 600 nA hFE DC current gain VCE =5V; IC = 400 mA 15 − 100 Ccb collector-base capacitance VCB = 16 V; VEB = 1.5 V; IE =IC = 0; f = 1 MHz − 3 − pF Cce collector-emitter capacitance VCE = 16 V; VEB = 1.5 V; IE =IC = 0; f = 1 MHz − 1.5 − pF Ceb emitter-base capacitance VCB = 10 V; VEB =1V; IC =IE = 0; f = 1 MHz − 28 − pF |
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