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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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AM29BL162C датащи(PDF) 15 Page - SPANSION |
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AM29BL162C датащи(HTML) 15 Page - SPANSION |
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15 / 19 page  14 Am29BL162C Known Good Die SU PPL EMEN T PRODUCT TEST FLOW Figure 1 provides an overview of AMD’s Known Good Die test flow. For more detailed information, refer to the Am29BL162C product qualification database. AMD implements quality assurance procedures throughout the product test flow. These QA procedures also allow AMD to produce KGD products without requiring or implementing burn-in. In addition, an off-line qualifica- tion maintenance program (QMP) guarantees AMD standards are met on KGD products. Figure 1. AMD KGD Product Test Flow Wafer Sort 1 Bake 24 hours at 250 °C Wafer Sort 2 Wafer Sort 3 High Temperature Packaging for Shipment Shipment DC Parameters Functionality Programmability Erasability Data Retention DC Parameters Functionality Programmability Erasability DC Parameters Functionality Programmability Erasability Speed Incoming Inspection Wafer Saw Die Separation 100% Visual Inspection Die Pack |
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