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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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AM29BL802C датащи(PDF) 13 Page - SPANSION |
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AM29BL802C датащи(HTML) 13 Page - SPANSION |
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13 / 17 page  12 Am29BL802C Known Good Die SU PP L E ME NT PRODUCT TEST FLOW Figure 1 provides an overview of AMD’s Known Good Die test flow. For more detailed information, refer to the Am29BL802C product qualification database supple- ment for KGD. AMD implements quality assurance pro- cedures throughout the product test flow. In addition, an off-line quality monitoring program (QMP) further guarantees AMD quality standards are met on Known Good Die products. These QA procedures also allow AMD to produce KGD products without requiring or implementing burn-in. Figure 1. AMD KGD Product Test Flow Wafer Sort 1 Bake 24 hours at 250 °C Wafer Sort 2 Wafer Sort 3 High Temperature Packaging for Shipment Shipment DC Parameters Functionality Programmability Erasability Data Retention DC Parameters Functionality Programmability Erasability DC Parameters Functionality Programmability Erasability Speed Incoming Inspection Wafer Saw Die Separation 100% Visual Inspection Die Pack |
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