S-S058

07-21-2020

°C

°C

°C

● Low profile package

● Ideal for automated placement

● Glass passivated chip junction

● High forward surge capability

● Super fast reverse recovery time

● Meets MSL level 1, per J-STD-020, LF maximum peak

of 260 °C

For use in high frequency rectification of power

supplies, inverters, converters, and freewheeling diodes for

consumer, and telecommunication.

● Package: SMAF

Molding compound meets UL 94 V-0 flammability

rating, RoHS-compliant, halogen-free

● Terminals: Tin plated leads, solderable per

J-STD-002 and JESD22-B102

● Polarity: Cathode line denotes the cathode end

■

(Ta=25

°C Unless otherwise specified）

PARAMETER

SYMBOL

UNIT

H1AF

H1BF

H1DF

H1GF

H1JF

H1KF

H1MF

Device marking code

H1AF

H1BF

H1DF

H1GF

H1JF

H1KF

H1MF

Repetitive peak reverse voltage

VRRM

V

50

100

200

400

600

800

1000

Average rectified output current

@60Hz sine wave, resistance load, TL (Fig.1)

IO

A

1.0

Surge(non-repetitive)forward current

@60Hz half-sine wave,1 cycle, Ta=25

IFSM

A

30

Storage temperature

Tstg

-55~+150

Junction temperature

Tj

-55~+150

■

（Ta=25 Unless otherwise specified）

PARAMETER

SYMBOL

UNIT

TEST

CONDITIONS

H1AF

H1BF

H1DF

H1GF

H1JF

H1KF

H1MF

Maximum instantaneous

forward voltage drop per diode

VF

V

IFM=1.0A

1.0

1.3

1.7

Maximum reverse recovery time

trr

ns

IF=0.5A,IR=1.0A,

Irr=0.25A

50

75

Maximum DC reverse current

at rated DC blocking voltage

per diode @ VRM=VRRM

IRRM

μA

Ta=25°C

5.0

Ta=125°C

100

°C

Surface Mount High Efficient Rectifier

H1AF Through H1MF

(SMAF)

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

FEATURES

TYPICAL APPLICATIONS

MECHANICAL DATA

■

■

■

■

（Ta=25°C Unless otherwise specified）

PARAMETER

SYMBOL

UNIT

H1AF

H1BF

H1DF

H1GF

H1JF

H1KF

H1MF

Thermal resistance

RθJ-A(1)

°C/W

751)

RθJ-L(1)

301)

THERMAL CHARACTERISTICS

Page 1 of 3

RFE International • Tel (949) 833-1988 • Fax (949) 833-1788 • E-mail sales@rfeinc.com

Note:

(1) Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.2" x 0.2" (5.0 mm x 5.0 mm) copper pad areas