Metalized Polyester Film Capacitors

MEB: General Purpose, Box Type

Solder temperature:

245 C ±5 C

Immersion me:

2.5 ± 0.5 seconds

Solder temperature:

260 C ±5 C

Immersion me:

10 ± 1 second

Thickness of heat shunt

(printed wiring board) 1.6mm

Performance:

(Capacitance change

C/C)

± 3%

DF change tan :

± 0.5% at 1 KHz

Bending strength:

There shall be no open or short-circui ng and the connec ons must be

stabilized.

Appearance:

There shall be no such mechanical damage as terminal damage, etc.

Performance:

(Capacitance change

C/C)

± 5%

DF change tan :

± 0.5% at 1 KHz

Insula on resistance:

50% of limit value

Performance:

(Capacitance change

C/C)

± 10%

DF change tan :

± 0.5% at 1 KHz

Insula on resistance:

50% of limit value

Solder bath method

Resistance to soldering heat: (Tes ng method IEC 68-2-20 Tb)

And then the capacitor shall be subjected to standard atmospheric condi ons for 1 to 2 hours, a er

which measurement shall be made.

Electrical endurance: (Tes ng method IEC 60384-2)

125% of category voltage shall be applied to the capacitor at a temperature of 110 C ±2 C for 1000

hours. And then the capacitor shall be subjected to standard atmospheric condi ons for 1 to 2 hours,

a er which measurement shall be made. The lead resistor in series with the capacitor shall be 20 to

1K .

Vibra on Proof: (Tes ng method IEC 68-2-6 Fc)

The frequency shall be varied form from 10Hz to 55Hz at 1.5mm amplitude and back to 10Hz in

approximately 1 minute intervals. This mo on shall be applied for a period of 2 hours in each of 3

mutually perpendicular direc ons. During the last 20 min of vibra on in each direc on, checks shall

be made for open or short-circui ng and interrup on.

Damp heat (steady state): (Tes ng method IEC 69-2-3 Ca)

The capacitor shall be stored at a temperature of 40 ±2 C and rela ve humidity of 90% to 95% for

1000 hours.

Performance:

At least 95% of the circumferen al face of lead wire up to immersed lecvel shall be covered with new

solder.

ENDURANCE CHARACTERISTICS

Solderability: (Tes ng method IEC 68-2-20 Ta)

Performance:

2-OCT-2023

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