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5、电性规格 Specification

6、焊接和安装 Soldering and Mounting

6-1. Soldering

6.2 Solder re-flow:

6.3 Soldering Iron(Figure 2):

7、包装信息 Packaging Information

Part Number

Common mode

Impedance (Ω)

[

Test Frequency

100MHz]

DC

Resistance

(Ω) Max.

Capacitance

(pF)Max

Rated

Current

(mA)Max.

Rated Volt.

(Vdc)Max.

Withstand

Volt. (Vdc)

Max.

IR

(Ω) Min.

AC2012F-900Z

90±25%

0.19

5

400

50

125

10M

AC2012F-121Z

120±25%

0.22

5

370

50

125

10M

AC2012F-201Z

200±25%

0.25

5

350

50

125

10M

AC2012F-361Z

360±25%

0.50

5

220

50

125

10M

AC2012F-681Z

681±25%

1.30

5

200

50

125

10M

AC2012F-102Z

1000±25%

1.50

5

190

50

125

10M

AC2012F-222Z

2200±25%

2.50

5

150

50

125

10M

Series

Chip/Reel

Carton

2012F

10000

100000

Recommended temperature profiles for re-flow soldering in Figure 1.

Mildly activated rosin fluxes are preferred. FPE terminations are suitable for all wave and re-flow soldering systems.

If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools.

Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event

that a soldering iron must be employed the following precautions are recommended.

‧Preheat circuit and products to 150℃

‧Never contact the ceramic with the iron tip

‧Use a 20 watt soldering iron with tip diameter of 1.0mm

‧350℃ tip temperature (max)

‧1.0mm tip diameter (max)

‧Limit soldering time to 4~5 sec.