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FTF3020-C/IG датащи(PDF) 13 Page - NXP Semiconductors

номер детали FTF3020-C/IG
подробное описание детали  Full Frame CCD Image Sensor
PDF  16 Pages
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производитель  PHILIPS [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

FTF3020-C/IG датащи(HTML) 13 Page - NXP Semiconductors

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1999 November
13
Philips Semiconductors
Product specification
Full Frame CCD Image Sensor
FTF3020-C
Figure 11 - Application diagram to protect the FTF3020-C
Device Handling
An image sensor is a MOS device which can be destroyed by electro-
static discharge (ESD). Therefore, the device should be handled
with care.
Always store the device with short-circuiting clamps or on conductive
foam. Always switch off all electric signals when inserting or removing
the sensor into or from a camera (the ESD protection in the CCD
image sensor process is less effective than the ESD protection of
standard CMOS circuits).
Being a high quality optical device, it is important that the cover
glass remain undamaged. When handling the sensor, use fingercots.
When cleaning the glass we recommend using ethanol (or possibly
water). Use of other liquids is strongly discouraged:
• if the cleaning liquid evaporates too quickly, rubbing is likely to
cause ESD damage.
• the cover glass and its coating can be damaged by other liquids.
Rub the window carefully and slowly.
Dry rubbing of the window may cause electro-static charges or
scratches which can destroy the device.
BAT74
Schottky!
VPS
SFD
VRD
BC
860C
BC
850C
VNS
+
-
BC
850C
27
15
10k
CR pulse
0
VCS
VOG
10k
10k
OUT
keep short
<10mm!
keep short!
output for
preprocessing
BFR
92A
BAT74
BAT74
BAT74
Schottky!
Ω
Ω
Ω
Ω
Ω
100 Ω
VSFD



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