7.4 Thermal Information: OPA392

THERMAL METRIC(1)

OPA392

UNIT

DBV (SOT-23)

YBJ (DSBGA)

5 PINS

6 PINS

RθJA

Junction-to-ambient thermal resistance

187.1

135.0

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

107.4

1.1

°C/W

RθJB

Junction-to-board thermal resistance

57.5

38.8

°C/W

ΨJT

Junction-to-top characterization parameter

33.5

0.4

°C/W

ΨJB

Junction-to-board characterization parameter

57.1

38.8

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.5 Thermal Information: OPA2392

THERMAL METRIC(1)

OPA2392

UNIT

D (SOIC)

YBJ (DSBGA)

8 PINS

9 PINS

RθJA

Junction-to-ambient thermal resistance

131.7

110.7

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

71.4

0.7

°C/W

RθJB

Junction-to-board thermal resistance

75.2

32.1

°C/W

ΨJT

Junction-to-top characterization parameter

21.8

0.3

°C/W

ΨJB

Junction-to-board characterization parameter

74.4

32.1

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

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OPA392, OPA2392

SBOS926E – JANUARY 2021 – REVISED SEPTEMBER 2023

Copyright © 2023 Texas Instruments Incorporated

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Product Folder Links: OPA392 OPA2392