2000 Dec 19

4

Philips Semiconductors

Preliminary specification

BZD142

GRAPHICAL DATA

handbook, halfpage

0

200

3

Ptot

(W)

0

1

2

MGU214

100

T (

°C)

Fig.2

Maximum total power dissipation as a

function of temperature.

Solid line: tie-point temperature; lead length = 10 mm.

Dotted line: ambient temperature; printed-circuit board mounted as

shown in Fig.4.

handbook, halfpage

10

1

MBL107

110

Cd

(pF)

VR (V)

Fig.3

Diode capacitance as a function of reverse

voltage; typical values.

handbook, halfpage

MGA200

3

2

7

50

25

50

Fig.4 Device mounted on a printed-circuit board.

Dimensions in mm.

handbook, halfpage

MGD521

IRSM

(%)

100

90

50

10

t1

t2

t

Fig.5

Non-repetitive peak reverse current pulse

definition.

In accordance with

“IEC 60060-1, Section 8”.