Environmental Performance Specifications:

Test

Reference

Conditions of Test

Requirement

Life

MIL-PRF-55342,

MIL-STD-202

Method 108A

70ºC, 2000h, rated power, 1.5h on, 0.5h off

± 0.5% + 0.01Ω

Thermal Shock

MIL-PRF-55342,

MIL-STD-202

Method 107G

Condition F-3, -65ºC/0.25h to 150ºC/0.25h, 100 cycles

± 0.1% + 0.01Ω

High Temperature Exposure

MIL-PRF-55342

150ºC, 100h

± 0.1% + 0.01Ω

Short Time Overload

MIL-PRF-55342

6.25x rated power, 5 sec.

± 0.1% + 0.01Ω

Moisture Resistance

MIL-PRF-55342,

MIL-STD-202

Method 106G

25/65/25/65/25/–10ºC, 90% to 98%RH, 10 cycles,

24h/cycle, with and without bias, bias = 1.5h on, 0.5h

off @ 1/10th rated power

± 0.1% + 0.01Ω

Resistance to Soldering Heat 1

MIL-PRF-55342,

MIL-STD-202

Method 210F

260ºC for 15 sec., over 220ºC for 60 sec., 3 cycles

± 0.1% + 0.01Ω

Solderability 2

MIL-PRF-55342,

MIL-STD-202

Method 208H

Precondition E: 150ºC dry bake for 16h,

Method 1 “Dip and Look Test”, 245ºC, 5 sec., Pb-free

(SnAgCu) Solder

Min 95%

coverage of

critical area

Board Flex

IEC 60115-1 /

JIS C 5202

Bend amount of 3mm, measurements during and after

bend

± 0.1% + 0.01Ω,

No mechanical

damage

Terminal Strength

MIL-PRF-55342

Force of 3kg for 30 sec.

No mechanical

damage

Notes:

1. Test conditions modified to represent the high temperature Pb-free reflow conditions and an extra cycle is added.

2. JESD22-B102D adds test conditions for Pb-free and is aligned with J-STD-002B referenced in MIL-STD-202 Method 208H.

JESD22-B102D procedure comes from EIA-638, “Surface Mount Solderability Test”.

Recommended Solder Pad Dimensions:

Dimensions (mm)

Size: Metric (Inch)

2512 (6332)

2525 (6363)

A

1.6

1.6

B

7.7

7.7

C

3.5

6.7

Notes on board construction and land design:

1. A multi-layer board with several ground or power planes significantly reduces thermal resistance.

2. Plated via holes around the power resistor further reduces thermal resistance.

3. Maximize land area beyond solder pad area in both width and length to further reduce thermal resistance.

4. Optimizing the thermal resistance of the board helps dissipate heat, enabling higher power handling and lower surface

temperatures.

Part Numbering: (Ex. BP2512S27R0J)

BP

2512

S

27R0

J

Product Designator

Size, Inch

TCR

Resistance Value

Tolerance

BP for BeO

CP for Alumina

Refer to table above

E = ± 25 ppm/C

H = ± 50 ppm/C

K = ± 100 ppm/C

S = ± 200 ppm/C

Ex. 27R0 = 27.0 Ω

F = ± 1%

G = ± 2%

J = ± 5%

Thin Film Technology Corp., 1980 Commerce Drive, North Mankato, MN 56003, (507) 625-8445

www.thin-film.com