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ATMEGA649 датащи(PDF) 3 Page - ATMEL Corporation |
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ATMEGA649 датащи(HTML) 3 Page - ATMEL Corporation |
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3 / 375 page ![]() 3 ATmega329/3290/649/6490 2552H–AVR–11/06 Figure 2. Pinout ATmega329/649 Note: The large center pad underneath the QFN/MLF packages is made of metal and internally connected to GND. It should be soldered or glued to the board to ensure good mechani- cal stability. If the center pad is left unconnected, the package might loosen from the board. Disclaimer Typical values contained in this datasheet are based on simulations and characteriza- tion of other AVR microcontrollers manufactured on the same process technology. Min and Max values will be available after the device is characterized. PC0 (SEG12) (RXD/PCINT0) PE0 (TXD/PCINT1) PE1 LCDCAP (XCK/AIN0/PCINT2) PE2 (AIN1/PCINT3) PE3 (USCK/SCL/PCINT4) PE4 (DI/SDA/PCINT5) PE5 (DO/PCINT6) PE6 (CLKO/PCINT7) PE7 (SCK/PCINT9) PB1 (MOSI/PCINT10) PB2 (MISO/PCINT11) PB3 (OC0A/PCINT12) PB4 (OC1B/PCINT14) PB6 (OC1A/PCINT13) PB5 PC1 (SEG11) PG0 (SEG14) PC2 (SEG10) PC3 (SEG9) PC4 (SEG8) PC5 (SEG7) PC6 (SEG6) PC7 (SEG5) PA7 (SEG3) PG2 (SEG4) PA6 (SEG2) PA5 (SEG1) PA4 (SEG0) PA3 (COM3) PG1 (SEG13) INDEX CORNER (SS/PCINT8) PB0 2 3 1 4 5 6 7 8 9 10 11 12 13 14 16 15 47 46 48 45 44 43 42 41 40 39 38 37 36 35 33 34 ATmega329/649 |
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