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BYV26G датащи(PDF) 2 Page - NXP Semiconductors

номер детали BYV26G
подробное описание детали  Fast soft-recovery controlled avalanche rectifiers
PDF  12 Pages
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производитель  PHILIPS [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BYV26G датащи(HTML) 2 Page - NXP Semiconductors

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1996 May 30
2
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYV26 series
FEATURES
• Glass passivated
• High maximum operating
temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy
absorption capability
• Available in ammo-pack.
DESCRIPTION
Rugged glass SOD57 package, using
a high temperature alloyed
construction.
This package is hermetically sealed
and fatigue free as coefficients of
expansion of all used parts are
matched.
Fig.1 Simplified outline (SOD57) and symbol.
2/3 page (Datasheet)
MAM047
ka



LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VRRM
repetitive peak reverse voltage
BYV26A
200
V
BYV26B
400
V
BYV26C
600
V
BYV26D
800
V
BYV26E
1000
V
BYV26F
1200
V
BYV26G
1400
V
VR
continuous reverse voltage
BYV26A
200
V
BYV26B
400
V
BYV26C
600
V
BYV26D
800
V
BYV26E
1000
V
BYV26F
1200
V
BYV26G
1400
V
IF(AV)
average forward current
Ttp =85 °C; lead length = 10 mm;
see Figs 2 and 3;
averaged over any 20 ms period;
see also Figs 10 and 11
BYV26A to E
1.00
A
BYV26F and G
1.05
A
IF(AV)
average forward current
Tamb =60 °C; PCB mounting (see
Fig.19); see Figs 4 and 5;
averaged over any 20 ms period;
see also Figs 10 and 11
BYV26A to E
0.65
A
BYV26F and G
0.68
A
IFRM
repetitive peak forward current
Ttp =85 °C; see Figs 6 and 7
BYV26A to E
10.0
A
BYV26F and G
9.6
A



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