1996 May 24

4

Philips Semiconductors

Product specification

Fast soft-recovery

controlled avalanche rectifiers

BYM26 series

THERMAL CHARACTERISTICS

Note

1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer

≥40 µm, see Fig.19.

For more information please refer to the

“General Part of associated Handbook”.

diode capacitance

see Figs 17 and 18

BYM26A to C

−

85

−

pF

BYM26D and E

−

75

−

pF

BYM26F and G

−

65

−

pF

maximum slope of reverse recovery

current

when switched from

see Fig.21

BYM26A to C

−−

7A/

µs

BYM26D and E

−−

6A/

µs

BYM26F and G

−−

5A/

µs

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

thermal resistance from junction to tie-point

lead length = 10 mm

25

K/W

thermal resistance from junction to ambient

note 1

75

K/W

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

dI

R

dt

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