Ratiometric Linear Hall Effect Sensor

for High-Temperature Operation

A1321, A1322,

and

A1323

8

Allegro MicroSystems, Inc.

115 Northeast Cutoff, Box 15036

Worcester, Massachusetts 01615-0036 (508) 853-5000

www.allegromicro.com

THERMAL CHARACTERISTICS may require derating at maximum conditions, see application information

Characteristic

Symbol

Test Conditions*

Value Units

Package Thermal Resistance

Package LH, 1-layer PCB with copper limited to solder pads

228

ºC/W

connected by thermal vias

110

ºC/W

Package UA, 1-layer PCB with copper limited to solder pads

165

ºC/W

*Additional thermal information available on Allegro website.

6

5

4

3

2

1

0

20

40

60

80

100

120

140

160

180

Temperature (ºC)

Power Derating Curve

(R

1-layer PCB, Package LH

(R

2-layer PCB, Package LH

(R

1-layer PCB, Package UA

0

100

200

300

400

500

600

700

800

900

1000

1100

1200

1300

1400

1500

1600

1700

1800

1900

20

40

60

80

100

120

140

160

180

Temperature (°C)

Power Dissipation versus Ambient Temperature

(R

JA

= 165

ºC/W

)

1-layer

PCB,

Package

UA

(R

JA

= 228

ºC/W)

1-layer

PCB,

Packag

e LH

(R

ºC/W

)

2-layer

PCB,

Package

LH