1999 Nov 11

3

Philips Semiconductors

Product specification

Fast soft-recovery

controlled avalanche rectifiers

BYD47 series

ELECTRICAL CHARACTERISTICS

THERMAL CHARACTERISTICS

Note

1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer

≥40 µm, see Fig.11.

For more information please refer to the

“General Part of associated Handbook”.

SYMBOL

PARAMETER

CONDITIONS

TYP.

MAX.

UNIT

forward voltage

−

2.05

V

−

2.40

V

reverse current

see Fig.9

−

5

µA

see Fig.9

−

50

µA

reverse recovery time

see Fig.12

−

300

ns

diode capacitance

15

−

pF

maximum slope of reverse recovery

current

see Fig.13

−

5A/

µs

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

thermal resistance from junction to tie-point

30

K/W

thermal resistance from junction to ambient

note 1

150

K/W

dI

R

dt

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