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LTM4643 датащи(PDF) 2 Page - Analog Devices |
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LTM4643 датащи(HTML) 2 Page - Analog Devices |
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2 / 30 page ![]() LTM4638 2 Rev. C For more information www.analog.com PIN CONFIGURATION ABSOLUTE MAXIMUM RATINGS VIN ............................................................. –0.3V to 22V VOUT............................................................. –0.3V to 6V INTVCC...................................................... –0.3V to 3.6V RUN ............................................................ –0.3V to VIN PGOOD, FREQ, COMPa, COMPb, PHMODE, CLKOUT, FB.............................. –0.3V to 3.6V MODE/CLKIN, TRACK/SS .....................–0.3V to INTVCC VOSNS+......................................................... –0.3V to 6V VOSNS–...................................................... –0.3V to 0.3V Internal Operating Temperature Range (Notes 2, 5)............................................ –40°C to 125°C Storage Temperature Range .................. –55°C to 125°C Peak Solder Reflow Body Temperature ................. 250°C (Note 1) (See Pin Functions, Pin Configuration Table) BGA PACKAGE 49-LEAD (6.25mm × 6.25mm × 5.02mm) TJMAX = 125°C, θJCtop = 10°C/W, θJCbottom = 4.2°C/W, θJA = 16°C/W TOP VIEW 5 1 2 3 4 7 6 A B C D E F G NOTE: 1) θ VALUES ARE DETERMINED BY SIMULATION PER JESD51 CONDITIONS, WEIGHT 660mg 2) θJA VALUE IS OBTAINED WITH DEMO BOARD 3) REFER TO PAGES 21, 22 FOR LAB MEASUREMENT AND DE-RATING INFORMATION VOUT VIN PHMODE GND TSENSE– TSENSE+ SW CLKOUT COMPb FREQ VOSNS– MODE/CLKIN TRACK/SS VOSNS+ INTVCC RUN PGOOD FB COMPa VOUT ORDER INFORMATION PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE TYPE MSL RATING TEMPERATURE RANGE (NOTE 2) DEVICE FINISH CODE LTM4638EY#PBF SAC305 (RoHS) 4638 e1 BGA 3 –40°C to 125°C LTM4638IY#PBF SAC305 (RoHS) 4638 e1 BGA 3 –40°C to 125°C LTM4638IY SnPb 4638 e0 BGA 3 –40°C to 125°C • Contact the factory for parts specified with wider operating temperature ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. • Recommended LGA and BGA PCB Assembly and Manufacturing Procedures • LGA and BGA Package and Tray Drawings |
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