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PKB4213DPI датащи(PDF) 20 Page - Flex Power Modules. FLEX LTD. |
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PKB4213DPI датащи(HTML) 20 Page - Flex Power Modules. FLEX LTD. |
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20 / 28 page ![]() Thermal Consideration General The products are designed to operate in different thermal environments and sufficient cooling must be provided to ensure reliable operation. For products mounted on a PWB without a baseplate attached, cooling is achieved mainly by conduction, from the pins to the host board, and convection, which is dependant on the airflow across the product. Increased airflow enhances the cooling of the product. The Output Current Derating graph found in the Output section for each model provides the available output current vs. ambient air temperature and air velocity at VI = 53 V. The product is tested on a 254 x 254 mm, 35 µm (1 oz), 16-layer test board mounted vertically in a wind tunnel with a cross-section of 608 x 203 mm. For products with baseplate used in a sealed box/cold wall application, cooling is achieved mainly by conduction through the cold wall. The Output Current Derating graphs are found in the Output section for each model. The product performance has been tested in a sealed box presented in the figure below. The ambient temperature (inside the box) has been set to 85°C. The cold wall temperature varied. See Design Note 028 for further details. Definition of product operating temperature The temperature at the positions (TP1, TP2) should not exceed the maximum temperatures in the table below. The number of measurement points may vary with different thermal design and topology. Temperatures above maximum measured at the reference point P1, P2 are not allowed and may cause permanent damage. Position Description Max Temp. P1 Mosfet, Reference point TP1=125º C P2 Transformer core TP2=125º C Open frame P1 P2 PKB4000D series Fully regulated DC-DC Converters Input 36-75 V, Output up to 25 A / 300 W 28701-BMR674 01 Rev G July 2019 © Flex Technical Specification 20 |
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