ES9039MSPRO datasheet(93/95 Pages) ESS

номер детали	ES9039MSPRO

подробное описание детали	32-bit High-Performance 8-Channel DAC

PDF	95 Pages

Scroll/Zoom	100%

производитель	ESS [ESS Technology,Inc]

домашняя страница	http://www.esstech.com

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93 / 95 page

ES9039MPRO & ES9039PRO Datasheet

CONFIDENTIAL ADVANCE INFORMATION 0.2.1

ESS TECHNOLOGY, INC. 109 Bonaventura Drive, San Jose, CA 95134, USA Tel (408) 643-8800 • WWW.ESSTECH.COM

RPC-2 Pb-Free Process – Classification Temperatures (Tc)

Package Thickness

Volume mm3, <350

Volume mm3, 350 to 2000

Volume mm3, >2000

<1.6 mm

260°C

1.6 mm – 2.5 mm

260°C

250°C

245°C

>2.5 mm

250°C

245°C

Table 11 – RPC-2 Pb free classification temperatures

At the discretion of the device manufacturer, but not the board assembler/user, the maximum peak package body temperature (Tp) can exceed the

values specified in Table RPC-2. The use of a higher Tp does not change the classification temperature (Tc).

Package volume excludes external terminals (e.g., balls, bumps, lands, leads) and/or nonintegral heat sinks.

The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processes

reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD packages may still exist.

ES9039MSPRO датащи(PDF) 93 Page - ESS Technology,Inc