Nexperia

PUSB3BB2DF

Extremely low clamping low capacitance ESD protection

12. Soldering

SOT8013

Footprint information for reflow soldering of ultra small and leadless encapsulated package; 3 terminals

sot8013_fr

Issue date 19-10-29

20-02-26

occupied area

solder land

(Cu extends under

solder resist)

solder resist

stencil opening

Dimensions in mm

0.85

0.33 0.48

0.68

0.145

0.12

0.12

0.12

0.15

0.15

0.145

0.135

0.135

0.1

0.95

recommended stencil thickness: 0.08 mm

R 0.03

Fig. 22. Reflow soldering footprint for DFN0603-3 (SOT8013)

PUSB3BB2DF

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Product data sheet

3 November 2020

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